Tohoku University Technology: A semi-solid diecast product with its particles’ diameter as 2~4μm: T12-102
A cost down semi-solid die-casting method, applicable to present apparatus
Compared with semi-solid diecast products, the ones produced by conventional diecast methods not only arise rougher surface, but also trend to fail to fill up the end surface with thickness of 0.1mm. So far, semi-solid diecast method cannot be simply applied to conventional apparatus, and thus increased cost turns to be a problem in industry. This invention solves such a problem by optimization of proportion of solid phase, sleeve factor, and nucleation temperature for conventional apparatus. Semi-solid slurry can be generated in the sleeves of conventional apparatus, and notably, the thin surface fill-up result shows satisfied roughness and dimensional accuracy. [Substance] patent has been issued.
- 企業：Tohoku Techno Arch Co., Ltd.
- 価格：Other
